Microstructure and Mechanical Behavior of Cu–Al–Ag Shape Memory Alloys Processed by Accumulative Roll Bonding and Subsequent Annealing

Ultrafine-grained Cu/Al/Ag composites were processed by an accumulative roll bonding (ARB) technique from pure copper and aluminum sheets a silver powder. The Al content was fixed to 11 wt.% while the concentration 1, 2, or 3 in wt.%. ARB-processed samples heat treated at different temperatures between 750 1050 °C for 60 min then quenched room temperature (RT) producing Cu–Al–Ag alloys. effect of addition Ag contents various treatment on structural evolution investigated. composed Cu layers with high dislocation density fine grain size (a few microns). During samples, new intermetallic phases formed. For lowest (1 wt.%), main phase brittle simple cubic Al4Cu9, higher concentrations (2 contain mainly orthorhombic β1-AlCu3 martensite phase. consisted very lamellas thickness one micron less. increased microhardness strength RT due formation fine-grained hard 2 3% Ag, highest achieved 850 950 °C, respectively. annealed exhibited good shape memory behavior RT.